The RPI Semiconductor CoLab Catalyst Seminar Series welcome you on Tuesday, March 17th, 3:00–5:00 PM, in person at the ZEN Building, Albany NanoTech Complex. The seminar will feature Jacob Merson (RPI) and Dureseti (Chidu) Chidambarrao (IBM) presenting on thermal challenges and solutions for 3DHI Packages. The seminar is separated by a coffee break for networking, discussions and poster presentation.
Speakers:
Dureseti (Chidu) Chidambarrao, STSM, Thermal and Design-Technology-Manufacturing Solutions, IBM Research
3DHI Thermal Challenges - A Length Scale Perspective
Jacob Merson, Assistant Professor, RPI
An Approach to Multiscale Thermal Modeling of 3DHI Packages