The RPI Semiconductor CoLab Catalyst Seminar Series will continue on Tuesday, October 20th, 3:00–5:00 PM, in person at the ZEN Building, Albany NanoTech Complex. The seminar will feature Dureseti (Chidu) Chidambarrao (IBM) and Jacob Merson (RPI) discussing thermal challenges and solutions for 3DHI packages. The session is separated by a coffee break for networking, discussions and poster presentations.
Speakers:
Dureseti (Chidu) Chidambarrao, STSM, Thermal and Design-Technology-Manufacturing Solutions IBM Research
3DHI Thermal Challenges - A Length Scale Perspective
Jacob Merson, Assistant Professor, RPI
An Approach to Multiscale Thermal Modeling of 3DHI Packages