Professor, Mechanical, Aerospace, and Nuclear Engineering
Electrical-thermal-mechanical computational modeling of devices and packaging for reliability, model effect of microstructure on degradation and fatigue, model semiconductor crystal growth, predicted defect formation
Ni, J. Ring, M., Hao, J., Liu, Y., Maniatty, A.M., (2019) “Modeling effect of grain orientation on degradation in tin-based solder - Part II: Electromigration experiments”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(10), 1993-1999
Zhang, Y., Ni, J., Liu, Y., Maniatty, A.M. (2019) “Modeling effect of grain orientation on degradation in tin-based solder - Part I: Current-driven diffusion, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(3), 473-482
Maniatty, A.M., J. Ni, J., Liu, Y., Zhang, H., (2016) “Effect of microstructure on electromigration-induced stress:, J. Appl. Mech., 83, 011010
Karvani, P., Maniatty, A.M., (2015) “Modeling micromechanical response to thermal history in bulk grown aluminum nitride”, Phys. Stat. Solidi C, 12, 345-348
Maniatty, A.M., Karvani, P. (2015) “Constitutive relations for modeling single crystal GaN at elevated temperatures”, J. Engng. Mater. Tech., 137, 011002