The next great advancement in semiconductor development will require a new conception of the dimensions of the chip itself.
Current Research:
- Development of cooling strategies (liquid and/or air-based) in the package to transfer heat to ambient air
- Power packaging, thermal management, optical systems for sensing and control, smart systems development, lighting and visible light communications, monolithic optoelectronic integration and photonic integrated circuits, sensing for agriculture
- Electrical-thermal-mechanical computational modeling of devices and packaging for reliability; modeling effect of microstructure on degradation and fatigue; modeling semiconductor crystal growth, predicted defect formation
