Researchers develop new materials and techniques to improve chip performance, reliability, and resistance to damage.
Current Research:
- Fundamental interfacial and transport phenomena related to dielectric breakdown, device reliability, resistive memory, phase change, and thermal interface materials
- Ultrathin layer materials such as graphene that promote van der Waals epitaxial growth of interconnect metals; first-level metals including Ru, Re, and Ir; graphene as a barrier layer to prevent metal diffusion
- Epitaxial layer growth and in situ transport measurements to study and discover new materials for future interconnects which yield high conductivity at small (<10 nm) dimensions
- Semiconductor materials, epitaxy, and defects; interconnect materials and degradation mechanisms
- Multiscale simulations of the structure and properties of oxides as dielectrics, and methodologies used to search for alternative dielectrics to silicon dioxide