Professor, Chemical and Biological Engineering
My group works on fundamental interfacial and transport phenomena related to dielectric breakdown, device reliability, resistive memory, phase change and thermal interface materials. We build MEMs systems for thermal management.
Ogden, S. P., Yeap, K. B., Shen, T., Justison, P., Lu, T. M., & Plawsky, J. L. (2017). Method to Determine the Root Cause of Low-? SiCOH Dielectric Failure Distributions. IEEE Electron Device Letters, 38(1), 119-122.
Woodcock, C., Ng'oma, C., Sweet, M., Wang, Y., Peles, Y., Plawsky, J. (2019) Ultra-high heat flux dissipation with Piranha Pin Fins, International Journal of Heat and Mass Transfer, 128, 504-515
Ogden, S. P., Xu, Y., Yeap, K. B., Shen, T., Lu, T. M., & Plawsky, J. L. (2018). Charge transport model to predict dielectric breakdown as a function of voltage, temperature, and thickness. Microelectronics Reliability, 91, 232-242.
Bar-Cohen, A., Asheghi, M., Chainer, T. J., Garimella, S. V., Goodson, K., Gorle, C., ... & Joshi, Y. (2021) The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(10), 1546-1564.
Xu, Y., Lu, T.-M., Plawsky, J.L., (2022) A transport model describing how defect accumulation leads to intrinsic dielectric breakdown and post-breakdown conduction. Microelectronics Reliability 128, 114459.