Professor, Mechanical, Aerospace, and Nuclear Engineering
Metrology for spatially resolved temperature, thermal conductivity, and interface thermal resistance characterization to enable investigations of heat conduction and energy conversion in novel nanodevices, materials, and solid-state thermoelectrics
Zhang, Y., Zhu, W., Borca-Tasciuc, T. (2021), “Sensitivity and spatial resolution for thermal conductivity measurements using noncontact scanning thermal microscopy with thermoresistive probes under ambient conditions”, Oxford Open Materials Science, Volume 1, Issue 1, 2021, itab011, doi: 10.1093/oxfmat/itab011
Borca-Tasciuc, T. and Vafaei, S. (2005) “Anisotropic thermal diffusivity of aligned multiwall carbon nanotube arrays”, Journal of Applied Physics 98, 054309, doi: 10.1063/1.2034079
Youngsuk Son, Y., Pal, S.K., Borca-Tasciuc, T., Ajayan, P.M., Siegel, R.W. (2008) “Thermal resistance of the native interface between vertically aligned multiwalled carbon nanotube arrays and their SiO2/Si substrate”, Journal of Applied Physics 103, 024911, doi: 10.1063/1.2832405
Mehta, R.J., Zhang, Y., Karthik, C., Singh, B., Siegel, R.W., Borca-Tasciuc, T., Ramanath, G. (2012) “A new class of doped nanobulk high-figure-of-merit thermoelectrics by scalable bottom-up assembly”, Nature Materials volume 11, pages 233–240, doi: 10.1038/nmat3213
Pashayi, K., Fard, H.R., Lai, F., Iruvanti, S., Plawsky, J., Borca-Tasciuc, T. (2014) “Self-constructed tree-shape high thermal conductivity nanosilver networks in epoxy”, Nanoscale, 2014,6, 4292-4296, doi: 10.1039/C3NR06494H